diablo 3 power leveling IDF - RCM

Netease science and technology news in September 23rd, Intel (blog) the United States Information Technology Summit (IDF) today held in the United States tera power leveling, the company's president Otellini at the summit demonstrated the world's first based on the 22 nm manufacturing process can work chip on wafer.According to introduction, 22 nm process will occur in the future Intel processor.In recent years, the CPU process has been reduced diablo 3 power leveling, the most advanced has been put into production is 32 nm in the microprocessor diablo 3 gold, a low numerical enabled CPU to reduce energy consumption.Although there are many enterprises begin to say that Moore's law has failed, but Otellini said at the meeting was \